AsiaCCS SESP

Call for Paper

 

(pdf version)

Embedded computing has recently become more and more present in devices used in everyday life. A wide variety of applications, from consumer electronics to biomedical systems, require building up powerful yet cheap embedded devices.  In this context, embedded software has turned out to be more and more complex, posing new security challenging issues.  We broadly view that smartphones as mobile embedded systems.

This workshop aims to bring together the research efforts from both the academia and industry in all security and privacy aspects related to embedded systems and smart phones. We encourage submissions on all theoretical and practical aspects, as well as experimental studies of deployed systems. Topics of interests include (but are not limited to) the following subject categories related to embedded systems and smart phone:

  • Secure embedded system architecture
  • System‐level security design and simulation techniques for Embedded Systems
  • Verification and validation of Embedded Systems
  • Security and privacy for Cyber physical systems (Internet of Things) and networked sensor devices
  • Security implications for multicore, SoC‐based, and heterogeneous Embedded Systems and applications
  • Secure data management in Embedded Systems
  • Middleware and virtual machines security in Embedded Systems
  • Secure management of virtualized resources
  • Authenticating users to devices and services
  • Mobile Web Browsers
  • Usability
  • Rogue application detection and recovery
  • Vulnerability detection and remediation
  • Secure application development
  • Cloud support for mobile and embedded system security

Authors are invited to submit either Research Papers or Position Papers or both. Position Papers that define new problems in embedded systems and smartphones security or provide visions and clarifications of embedded systems and smartphones security are solicited. Regular Research Papers that present novel research results on security and privacy in embedded systems and smartphones.


Important Dates

Submissions Deadline: Feb. 1, 2013 extended to Feb. 8, 2013 Feb. 22, 2013

Acceptance Notification : Feb. 27, 2013 extended to Mar. 4, 2013

Camera Ready: Mar. 10, 2013

Workshop: May 7, 2013


Submission
Submissions must be written in English with at most 8 pages including the bibliography and appendices.  Short position papers of no more than 5 pages are also welcome. Please prefix your title with keyword "Position Paper:". Submissions are not anonymized. Submissions must be in double‐column ACM format with a font no smaller than 9 point. Please use the ACM SIG Proceedings Templates (download here). Only PDF files will be accepted. Accepted papers will be published by ACM Press as conference proceedings in USB thumb drives and in the ACM Digital Library. Electronic submission site: http://seclab.soic.indiana.edu/sesp13/

 

Note that the proceeding will be indexed by EI.

 

Organizers

Local Arrangement Chair:

Wenzhi Chen, Zhejiang University China.

 

Program Co‐Chairs:

Yan Chen, Northwestern University

Xiaofeng Wang, Indiana University, Bloomington

 

Web Chair:

Yinzhi Cao, Northwestern University

 

Chair for Information Systems (HotCRP):

Xiaoyong Zhou, Indiana University, Bloomington